Crouzet's GN Solid State Relays

Our GN series solid state relays (introduced in June 2000) are the next generation of industry standard "hockey pucks". An eventual replacement for the successful G series relays (first introduced in 1980), the GN series relay is designed around the need for thermal efficiency, noise immunity, reliability, ease of manufacturing, and upgrade flexibility. These parameters, along with other standard features not offered by many manufacturers, such as ratings up to 125 amps, an optional IP20 "touch safe" housing (pictured), LED indicator, and internal transient protection, provide system engineers with enhanced reliability and added convenience at a cost equivalent to or less than our competitions' relays.

WHAT MAKES THE GN A SUPERIOR SOLID STATE RELAY?
Epoxy-Free Design: The SCR die within a solid state relay generate heat proportional to the load current of the application and the forward-voltage drop of the die. The epoxy in an encapsulated solid state relay will expand as the die heat up during operation, and then contract as the die cool when the relay is shut off. The expansion and contraction of the epoxy stresses internal components within the solid state relay and may result in premature failure. Moreover, the encapsulant used in most solid state relays can ignite under fault conditions, resulting in a catastrophic failure. The epoxy-free design of a GN solid state relay eliminates these concerns and significantly improves overall reliability.

Direct-Bond Copper Substrate: The DBC substrate in the GN solid state relays minimizes the thermal impedance between the SCR die and the base plate. This allows the heat generated by the SCR die to transfer through the base plate and into the heat sink, or panel, more efficiently. Since the SCR die can transfer heat more efficiently, there is less mechanical stress placed on the solder joints in the assembly, effectively improving overall reliability.

"Bussed" Power Lead-Frame Design: Most solid state relays have power lead frames that are soldered to the PCB, or directly to the output terminals, which are themselves soldered into the PCB. This puts solder joints directly in the path of load current, which increases the probability of failure due to cold or cracked joints. The output leads of the GN series solid state relays connect directly to the DBC from the output terminals. This eliminates 20-40% of the solder joints in the load-current path (depending upon the competitor's relay), further eliminating the possibility of experiencing a field failure.

Internal Transient Protection & EMC Compliance: Each GN Solid State Relay is equipped with internal transient protection, which eliminates the need for adding additional MOV's or other transient suppressors. In addition, the GN solid state relays comply with level 3 requirements of the EMC Directive. While this is not necessarily an agency driven requirement in North America, it does provide design engineers with a solid state relay designed to provide an additional level of reliabilty when used in harsh industrial environments.

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